π Product Overview: Introducing the Upsiren 21W GPU CPU Heatsink Cooling Conductive Silicone Pad, a premium thermal pad meticulously designed to enhance heat dissipation in high-performance electronics. Available in sizes of 100x100mm and 120x20mm, this thermal pad is ideal for a spectrum of applications, including CPUs, GPUs, graphics cards, memory modules, mining machines, SSDs, notebooks, gaming equipment, and more.
π§ Key Features:
- Versatile Plasticity: This thermal pad is easily customizable; it can be cut to fit various shapes and sizes to meet your specific cooling needs.
- Durable Composition: Engineered for longevity, the pad is both insulating and non-conductive. It is non-corrosive, non-curing, and entirely non-toxic, ensuring safety in diverse applications.
- User-Friendly Design: Eliminate the hassle of traditional thermal grease application. Simply peel off the protective films on both sides and place the pad where you need it.
- Wide Compatibility: Use this thermal pad for a range of heating elements such as CPU, GPU, graphics cards, memory, mining devices, SSDs, laptops, LED systems, servers, and household appliances.
π‘οΈ Specifications:
- Color: Gray
- Density: 3.5Β±02g/cc
- Hardness: 30-50 Shore C
- Thermal Conductivity: 21W/mK
- Breakdown Voltage: 9.8KV/mm
- Corrosive Properties: None
- Available Sizes: 120x20mm, 100x100mm, 85x45mm
Installation Instructions:
- To install the thermal pad, align it with the heat-generating component. Itβs much simpler than using thermal paste, ensuring ease of use even for beginners.
- When replacing thermal pads, always remove the old one and clean the surface thoroughly before applying a new pad to maintain optimal cooling performance.
π Size and Thickness Guidance:
- Determine the dimensions of the area requiring cooling.
- Consider the gap between components when calculating the necessary thickness of the thermal pad.
- Due to the pliability of the pad, consider adding an extra 0.5-1.0mm to ensure a snug fit after installation.
- If the purchased thermal pad thickness falls short, multiple layers can be stacked for enhanced performance.
- Optimal heat dissipation is achieved when both sides of the thermal pad are closely adhered without being excessively compressed.
π Note: Please be aware that monitor settings and lighting may cause slight variations in color from the actual product. A measuring deviation of 1-2cm may also occur due to manual measurement.