Thermal Putty UTP8 for Rapid Cooling and Heat Management (100g)

😎 UPSIREN Thermal Putty UTP8 is an advanced thermal interface material designed for efficient heat management in electronic components, specifically suitable for VGA GPU IC processors. This innovative putty offers a superior alternative to traditional thermal pastes and pads, providing rapid cooling and enhanced thermal conductivity.

Key Product Parameters:

• Thermal Conductivity: 14.8W/mk, ensuring optimal heat transfer and effective cooling.
• Color: Vibrant pink, allowing easy visual identification.
• Density: 3.5g/cm³, providing a compact and efficient application.
• Minimum Bond Line Thickness: 0.1 mm, allowing for flexible usage depending on the specific requirements of your application.
• Temperature Range: Operates effectively from -55℃ to +200℃, making it suitable for a wide variety of environments and conditions.
• Breakdown Voltage: >8000 V/mm, ensuring electrical safety and stability in high-demand applications.
• Volume Resistivity: 10¹³ ohm-cm, providing excellent electrical insulation.
• Flammability Rating: V-0, indicating a high level of fire resistance to enhance safety.
• RoHS Compliant: Yes, meeting environmental standards to ensure it is safe for both consumers and the planet.
• Shelf Life: Up to 18 months, allowing for long-term usability without compromising performance.

🧩 Upgrade Features: The UTP8 thermal putty is designed to be more delicate compared to the U6 Pro paste, enhancing the heat dissipation effect significantly. This makes it an excellent choice for high-performance applications where efficient cooling is essential.

⚙️ Invest in the UPSIREN Thermal Putty UTP8 for reliable thermal management solutions that maximize the efficiency and lifespan of your electronic devices.